By continued investing staffs, technology and expertise in process within our manufacturing facility, we could assemble a wide range of mixed technologies including THT, SMT and BGA placement. This approach enable us become a specialist PCB assembly manufacturer with the latest, state-of-art equipment.
1. SMT Assembly
High quality surface mounting requires high quality solder paste printing. At SBT we utilise the equipment which auto aligns PCB then print the paste with constant speed and pressure. Pick & place machines make sure each component placed accurately by laser alignment.
High quality of both multi-zone, Infra Red Reflow Oven & In-line AOI inspection system enable the solder quality much better.
2. Through-Hole Assembly
Many PCBs requires conventional through-hole & mixed technology assembly, although surface-mount technology is more common nowadays. Through-hole plating is very useful especially at the process of PCB prototyping and testing, as components can easily be swapped out. Also the through-hole components are more durable and high environmental & power tolerance.
Bi-directional jet-flow wave solder with integrated spray-fluxer means SBT can produce one-offs to large quantities, and more cost effectively than hand solder.
